スポンサーリンク
Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan | 論文
- Chemical vapor deposition of nanocarbon on electroless NiB catalyst using ethanol precursor (Special issue: Advanced metallization for ULSI applications)
- Grain Growth Enhancement of Electroplated Copper Film by Supercritical Annealing
- Current Induced Grain Growth of Electroplated Copper Film (Special Issue : Advanced Metallization for ULSI Applications)
- Thermally Stimulated Current Analysis of Defects in Sol-Gel Derived SrTaO Thin-Film Capacitors (Special Issue : Ferroelectric Materials and Their Applications)
- Barrier Integrity of Electroless Diffusion Barriers and Organosilane Monolayer against Copper Diffusion under Bias Temperature Stress
- Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects
- Heat-Resistant Co--W Catalytic Metals for Multilayer Graphene Chemical Vapor Deposition
- Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects (Special Issue : Advanced Metallization for ULSI Applications)