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Semiconductor Tech.lab. Oki Electric Industry Co. Ltd. | 論文
- Thermal Stability of Interconnect of TiN/Cu/TiN Multilayered Structure
- A New Mechanism of Failure in Silicon p^+/n Junction Induced by Diffusion Barrier Metals
- Submicron Ferroelectric Capacitors Fabricated by Chemical Mechanical Polishing Process for High-Density Ferroelectric Memories
- Submicron Ferroelectric Capacitors Fabricated by CMP Process for High-Density FeRAMs
- Copper Interconnects Fabricated by Dry Etching Process
- SiC/SiN Multilayer Membrane for X-Ray Mask Deposited by Low Pressure Chemical Vapor Deposition
- High-Reliability Copper Interconnects through Dry Etchirng Process