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Semiconductor Tech.Lab., Oki Electric Industry Co., Ltd. | 論文

• Thermal Stability of Interconnect of TiN/Cu/TiN Multilayered Structure
• A New Mechanism of Failure in Silicon p^+/n Junction Induced by Diffusion Barrier Metals
• Submicron Ferroelectric Capacitors Fabricated by Chemical Mechanical Polishing Process for High-Density Ferroelectric Memories
• Submicron Ferroelectric Capacitors Fabricated by CMP Process for High-Density FeRAMs
• Copper Interconnects Fabricated by Dry Etching Process
• High-Reliability Copper Interconnects through Dry Etchirng Process

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