スポンサーリンク
School Of Mechanical Engineering Chung-ang University | 論文
- Wetting Transition Characteristics on Microstructured Hydrophobic Surfaces
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Optical Characteristics and Nanoscale Energy Transport in Thin Film Structures Irradiated by Nanosecond-to-Femtosecond Lasers
- Wave Interference Effect in Thin Film Structures under Pulsed Laser Irradiation
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Spectral and Angular Responses of Surface Plasmon Resonance Based on the Kretschmann Prism Configuration
- Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
- Femtosecond Laser Pulse Train Effect on Optical Characteristics and Nonequilibrium Heat Transfer in Thin Metal Films
- Three Temperature Model for Nonequilibrium Energy Transfer in Semiconductor Films Irradiated with Short Pulse Lasers
- Novel Miscible Blends Composed of Poly(Methyl Methacrylate) and 2,2-Bis(3,4-Carboxyphenyl)Hexafluoropropane Dianhydride-Based Polyimides with Optical Grade Clarity
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Development of the WSGGM Using a Gray Gas Regrouping Technique for the Radiative Solution within a 3-D Enclosure Filled with Nonuniform Gas Mixtures(Advanced Fluid Information)
- Comparison of Theoretical Models of Electron-Phonon Coupling in Thin Gold Films Irradiated by Femtosecond Pulse Lasers
- Flattening Characteristics of Ni_Cr Thermal-Sprayed Coating Layers on Preheated SCM415 Substrates
- Modeling of Droplet Collision Process in Inter-Spray Impingement System
- Thermal Boundary Resistance Effect on Non-Equilibrium Energy Transport in Metal-Dielectric Thin Films Heated by Femtosecond Pulse Lasers
- Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
- Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
- Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)