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Ntt Advanced Technology Corp. | 論文
- Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
- Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
- Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
- RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
- Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- Integrated RF-MEMS Technology with Wafer-Level Encapsulation
- Thick-Dielectric Formation and MOSFET Reliability with Spin-Coating Film Transfer and Hot-Pressing Technique for Seamless Integration Technology
- Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control
- The First Radioastronomical Observation with Photonic Local Oscillator
- Optical Characteristics and Reliability of Plastic Ferrules for MU-Type Simplified Receptacles(Connector and Sliding Contacts)(IS-EMD2003 : Recent Technical Trend of Electro-Mechanical Devices)
- Long-Term Reliability of Plastic Ferrules for Single-Mode Fiber-Optic Connectors
- Long-Term Reliability of Plastic Split Alignment Sleeves for Single-Mode Fiber-Optic Connectors
- Effect of Surface Roughness Profiles on Optical Characteristics of Plastic Split Sleeves for Single-Mode Fiber-Optic Connectors
- Injection Molded Fiber-Optic Connector Components for Single-Mode Fiber Applications
- Static Fatigue Reliability of Plastic Split Alignment Sleeve for Single-Mode Optical Connection (Special Issue on Electromechanical Devices and Their Materials)
- Design and Performance of a Millimeter-Wave Video-Transmission System Using 60-GHz Band for Indoor BS Signals Transmission(Special Issue on Millimeter-Wave Circuit and Fabrication Technologies Opening up the 21st Century)
- Proposed Changes to Radiated RF-Field Immunity Test Method to Better Measure Acoustic Noise in Telephones (Special Issue on Discharge and Electromagnetic Interference)
- Soft X-Ray Reduction Lithography Using Multilayer Mirrors : X-Ray Lithography
- Soft X-Ray Reduction Lithography Using Multilayer Mirrors