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National Chiao‐tung Univ. Hsinchu Twn | 論文
- Enhancement of Barrier Properties in Chemical Vapor Deposited TiN Employing Multi-Stacked Ti/TiN Structure
- Effectively Blocking Copper Diffusion at Low-k Hydrogen Silsesquioxane/Copper Interface
- Enhancing the Oxygen Plasma Resistance of Low-k Methylsilsesquioxane by H_2 Plasma Treatment
- Characteristics of Photogenerated Bipolar Terahertz Radiation in Biased Photoconductive Switches : Optical Properties of Condensed Matter
- Characteristics of Yba_2Cu_3O_7 Thin Films Deposited on Substrates Buffered by Various TiO_2 Layers : Superconductors
- The Growth and Characterization of Silicon/Silicon Carbide Heteroepitaxial Films on Silicon Substrates by Rapid Thermal Chemical Vapor Deposition
- Critical Current Densities of Submillimeter Single-Grain Tl-2223 Superconducting Thin Film
- Enhancement of Data Transfer Rate of Phase Change Optical Disk by Doping Nitrogen in Ge-In-Sb-Te Recording Layer
- The Characterization of Al_2O_3 Prepared by Anodic Oxidation
- Optical and Electrical Characteristics of CO_2-Laser-Treated Mg-Doped GaN Film
- Epitaxial Growth of the GaN Film by Remote-Plasma Metalorganic Chemical Vapor Deposition
- Reactively Sputtered Amorphous TaSi_xN_y Films Serving as Barrier Layer Against Copper Diffusion
- Novel Implantation Method to Improve Machine-Model Electrostatic Discharge Robustness of Stacked N-Channel Metal-Oxide Semiconductors (NMOS) in Sub-Quarter-Micron Complementary Metal-Oxide Semiconductors (CMOS) Technology : Semiconductors
- A Novel Pickup Head Design for DVD-Multi System
- Wide-Band Two-Stage Erbium-Doped Fiber Amplifier Module in Parallel Configuration
- Bi-Directional Hybrid Optical Fiber Amplifier for C or C-plus-L Band
- Characterization of Diamond Films Grown on Amorphous SiO_2
- Traceability on Low-Computation Partially Blind Signatures for Electronic Cash
- Superconducting Property and Structure Studies of YBa_2Cu_3O_7-Ag_2O Composites
- A Parallel-In Folding Technique for High-Order FIR Filter Implementation(VLSI Architecture,VLSI Design and CAD Algorithms)