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Department of Metallurgical Engineering, Hanyang University | 論文
- Diffusion Barrier Property of Molybdenum Nitride Films for Copper Metallization
- Effects of NH_3 Plasma Treatment of the Substrate on Metal Organic Chemical Vapor Deposition of Copper Films
- The Effects of Pretreatment, CH_4 Gas Ratio and Bias Potential on the Microstructure of Microwave Plasma Enhanced Chemical Vapor Deposited Diamond Thin Films
- Effects of Chemical Interaction between Ta and SiOF on the Crystallinity of Cu and Ta in Cu/Ta/SiOF Films
- The Removal of Intentionally Contaminated Cu Impurities on Si Substrate Using Remote H-plasma Treatments
- INDUCTION OF OOCYTE MATURATION AND OVULATION BY THE IMPLANTATION OF LHRH-ANALOGUE IN KOREAN SEA BASS AND SPOTTED SEA BASS
- Preparation and Characterization of α-Amylase Immobilized inorganic/Organic Hybrid Membrane Using Chitosan as a Dispersant in the Sol-Gel Process
- Self-Assembled Process for the Preparation of Ultra-thin Zeolite Films
- The effect of silicon content in the high temperature tensile test
- The Effects of Pretreatment, CH4 Gas Ratio and Bias Potential on the Microstructure of Microwave Plasma Enhanced Chemical Vapor Deposited Diamond Thin Films