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Department of Materials Engineering, Hanyang University | 論文
- Hydrogen Reduction of Fe_2O_3/WO_3 Mixture with Synthesis of Nanocrystalline Fe/W Composite
- Remote Plasma-Assisted Metal Organic Chemical Vapor Deposition of Tantalum Nitride Thin Films with Different Radicals
- Barrier Metal Properties of Amorphous Tantalum Nitride Thin Films between Platinum and Silicon deposited using Remote Plasma Metal Organic Chemical Vapor Method
- Reduction Kinetics and Mechanisms of NiFe_2O_4 with Synthesis of Nanocrystalline Fe-Ni Alloy
- Highly Anisotropic Etching of Tungsten-Nitride for an X-Ray Mask Absorber with an Inductively Coupled Plasma System
- Investigation of Silicon Oxide Thin Films Prepared by Atomic Layer Deposition Using SiH_2Cl_2 and O_3 as the Precursors
- Electrical and Microstructural Degradation with Decreasing Thickness of (Ba, Sr)TiO_3 Thin Films Deposited by RF Magnetron Sputtering
- Effects of SF_6 Addition to O_2 Plasma on Polyimide Etching
- Study on the Properties of Interlayer Low Dielectric Polyimide during Cl-Based Plasma Etching of Aluminum
- Effect of Chromium on Nitrogen Solubility in Liquid Fe-Cr Alloys Containing 30mass% Cr
- Thermodynamic Interactions of Nb and Mo on Ti in Liquid Iron
- Low Temperature Isothermal Reduction Kinetics of Fe_2O_3/NiO Mixed Oxides and Comparative Synthesis of Fe_Ni_x Alloys
- Mill Scale for Synthesis of Fe-Ni and Fe-Ni-Co Alloys through Gaseous Reduction : Reaction Kinetics and Mechanism
- The Effect of Temperature on Microstructure, Magnetic Properties and Reaction Kinetics of Ni_Co_Fe_2O_4 Reduction in Hydrogen Atmosphere
- Thermal Synthesis of Nanocrystalline (Co_xNi_)_yFe_ KOVAR Alloy through Gaseous Reduction of Mixed Oxides
- Recovery of Molybdenum from Spent Acid by Ammonia Gas Neutralization
- Pt/Ti Thin Film Adhesion on SiN_x/Si Substrates
- Thermodynamic Interaction between Chromium and Aluminum in Liquid Fe-Cr Alloys Containing 26 mass% Cr
- Investigation of Mechanical Properties and Elongated Ni Grain Growth in an Al_2O_3-Ni Composite during Low-Energy Ball Milling
- Preparation of Conductive Nanoink Using Pulsed-Wire-Evaporated Copper Nanoparticles for Inkjet Printing