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Department Of Electronic Engineering Graduate School Of Engineering Tohoku University | 論文
- 21aXF-4 TEM-EELS による二層カーボンナノチューブの電子構造の研究 II
- 三重県で初めてのリフレッシュ理科教室
- Intrinsic Microcrystalline Silicon Thin Films Prepared by Hot-Wire Cell Method and Their Application to Solar Cells
- 2-Step Growth Method and Microcrystalline Silicon Thin Film Solar Cells Prepared by Hot Wire Cell Method
- PJ-259 Carotid Artery Elasticity Using the Phased-Tracking Method is Useful as a Risk Factor for Ischemic Heart Disease(PJ044,Atherosclerosis (Clinical/Diagnosis) 2 (IHD),Poster Session (Japanese),The 73rd Annual Scientific Meeting of The Japanese Circula
- Angiotensin II and epidermal growth factor receptor cross-talk mediated by a disintegrin and metalloprotease accelerates tumor cell proliferation of hepatocellular carcinoma cell lines
- A nonlinear cepstral compensation method for noisy speech processing (第1回音声言語シンポジウム(SPLC))
- A nonlinear cepstral compensation method for noisy speech processing (第1回音声言語シンポジウム(SPLC))
- Improvement of Rinsing Efficiency after Sulfuric Acid Hydrogen Peroxide Mixture (H_2SO_4/H_2O_2) by HF Addition
- ナノ電子素子から燃料電池自動車まで,大きく広がるその可能性 カーボンナノチューブの応用 (特集 カーボンナノチューブ)
- Characterization and Control of Native Oxide on Silicon
- Critical Thickness of Antiferromagnetic Layer in Exchange Biasing Bilayer System(Condensed matter: structure and mechanical and thermal properties)
- Uncompensated Spin Elements in Ferromagnetic and Antiferromagnetic Bilayer with Non-Collinear Spin Structure
- Low Power Neuron-MOS Technology for High-Functionality Logic Gate Synthesis (Special Issue on New Concept Device and Novel Architecture LSIs)
- A Model for the Electrochemical Deposition and Removal of Metallic Impurities on Si Surfaces (Special Issue on Scientific ULSI Manufacturing Technology)
- Spintronics in Data Storage : Specular and Nano-Constriction NOL
- A Study on Reclaimed Photoresist Developer Using an Electrodialysis Method
- A Study on Reclaimed Photoresist Developer Using an Electrodialysis Method
- Ultrashallow and Low-Leakage p^+n Junction Formation by Plasma Immersion Ion Implantation (PIII) and Low-Temperature Post-Implantation Annealing
- Flexible Processor Based on Full-Adder/D-Flip-Flop Merged Module (FDMM)