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Department Of Advanced Materials Engineering Sungkyunkwan University | 論文
- Influence of Ion-Irradiation on Hardness Change in Type 304 Stainless Steel Weldment Containing Delta(δ) Ferrite
- Mechanical Properties Related to Microstructural Variation of 6061 Al Alloy Joints by Friction Stir Welding
- The Joint Characteristics of Friction Stir Welded AZ91D Magnesium Alloy
- IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
- The Influence of the Machining and Assembling Errors on the Performance of the Shaft Supported by Active Magnetic Bearings
- Static and dynamic Properties of the Vortices in Single Crystalline CeRu_2
- Effect of Annealing Temperature on Dielectric Constant and Bonding Structure of Low-k SiCOH Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition
- Hydrogenation Properties of Partially Remelted Mg-Ni Alloys
- A novel high-profit recycling technology for aluminum scraps
- Effect of microstructure controls on hydrogenation properties of Mg alloys
- Fabrication and Properties of a 4×4 LiNbO_3 Optical Matrix Switch
- Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
- Effect of Surface Finishes on Ball Shear Strength in BGA Joints with Sn-3.5mass%Ag Solder
- The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
- Qualitatively differential regulation of T cell activation and apoptosis by T cell receptor ζ chain ITAMs and their tyrosine residues
- Exchange Bias and Spin-Value Giant Magnetoresistance in Multilayers with Mn-17mol%Ir-2mol%Pt Antiferromagnetic Layer
- Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy
- Interfacial Reactions Between Sn-58 mass% Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
- Annealing Effect on the Optical Properties of a-SiC:H Films Deposited by PECVD
- Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis