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Ajou Univ. Suwon Kor | 論文
- Challenge to 0.13μm Device Patterning using KrF
- Challenge to 0.13μm Device Patterning using KrF
- Challenge to 0.13μm Device Patterning using KrF
- Role of PKC-δ during Hypoxia in Heart-Derived H9c2 Cells
- High-Glucose Induced Protective Effect against Hypoxic Injury Is Associated with Maintenance of Mitochondrial Membrane Potential
- KR-31466, a Benzopyranylindol Analog, Attenuates Hypoxic Injury Through Mitochondrial K_ATP Channel and Protein Kinase C Activation in Heart-Derived H9c2 Cells
- Protein Kinase C Inhibitors Attenuate Protective Effect of High Glucose against Hypoxic Injury in H9c2 Cardiac Cells
- Electrical Properties of Crystalline Ta_2O_5 with Ru Electrode
- Electrical Properties of Ru/Ta_2O_5/Ru Capacitor for 1 Giga-Scale DRAMs and Beyond
- The Electrical Properties of Concave-type (Ba,Sr) TiO_3 Capacitors for Advanced Memories
- The Electrical Properties of Concave-type (Ba,Sr) TiO_3 Capacitors for Advanced Memories
- The Electrical Properties of Concave-type (Ba,Sr) TiO_3 Capacitors for Advanced Memories
- Mossbauer Study of (Fe_Co_x)_7Se_8
- Remote Plasma-Assisted Metal Organic Chemical Vapor Deposition of Tantalum Nitride Thin Films with Different Radicals
- Barrier Metal Properties of Amorphous Tantalum Nitride Thin Films between Platinum and Silicon deposited using Remote Plasma Metal Organic Chemical Vapor Method
- Low Dielectric Constant 3MS α-SiC:H as Cu Diffusion Barrier Layer in Cu Dual Damascene Process
- Evaluation of PECVD a-SiC:H as a Cu Diffusion Barrier Layer of Cu Dual Damascene Process
- A New, Low-Thermal-Budget Planarization Scheme for Pre-Metal Dielectric Using Electron-Beam Cured Hydrogen Silsesquioxane in Device
- A Novel and Low Thermal Budget Planarization Scheme for Pre-Metal Dielectric Using Electron-Beam Cured HSQ (Hydrogen Silsesquioxane) in STC (Stacked Capacitor) DRAM
- Al-Reflow Process with a "Cap-Clamp" for Sub-Micron Contact Holes