Chen S | Applied Materials Inc.
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概要
Applied Materials Inc. | 論文
- CuAl合金シードを用いたCu配線の信頼性改善
- Characterization of Low-Temperature Stress Hump in Relation to Phase Formation Sequence of Nickel Silicide
- Extending CVD Low-k Interlayer Dielectric Solutions to 45nm and Beyond
- Decoupled Plasma Source Technology: Process Region Choices For Silicide Etching
- Highly Selective SiO_2 Etch Employing Inductively Coupled Hydro-Fluorocarbon Plasma Chemistry for Self Aligned Contact Etch