Hong Gary | Specialty Technology Division United Microelectronics Corporation
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概要
関連著者
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Hong Gary
Specialty Technology Division United Microelectronics Corporation
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Huang Heng-sheng
Institute Of Automation Technology National Taipei University Of Technology
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LIN Shyh-Jye
Institute of Mechatoronic Engineering, National Taipei University of Technology
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Lin Chih-hung
Specialty Technology Division United Microelectronics Corporation
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Su Jason
Institute Of Mechatronics National Taipei University Of Technology
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Ting Wen-chi
Specialty Technology Division United Microelectronics Corporation
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Lee Dong-lung
Institute Of Mechatronics National Taipei University Of Technology
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Lee Ryan
Specialty Technology Division, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
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Lee Ryan
Specialty Techology Division United Microelectronics Corporation
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Chen Y‐j
National Cheng Kung Univ. Tainan Twn
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Lin C‐h
National Central Univ. Chung‐li Twn
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HUANG Heng-Sheng
Institute of Mechatronics Engineering, National Taipei Universityof Technology
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LIN Shyn-Jye
Institute of Mechatronics Engineering, National Taipei Universityof Technology
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CHEN Ying-Jyh
Institute of Mechatronics Engineering, National Taipei Universityof Technology
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CHEN I-Kai
Institute of Mechatronics Engineering, National Taipei Universityof Technology
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CHOU J.
Specialty Techology Division, United Microelectronics Corporation
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HONG Gary
Specialty Techology Division, United Microelectronics Corporation
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SHIU Jen-Shiuan
Institute of Mechatoronic Engineering, National Taipei University of Technology
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CHOU Jih-Wen
Specialty Technology Division, United Microelectronics Corporation
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Chou Jih
Specialty Techology Division United Microelectronics Corporation
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Hong G
Rodel‐nitta Co. Nara Jpn
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Huang H‐s
National Taipei Univ. Technol. Taipei Twn
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Lin S‐j
National Chiao‐tung Univ. Hsinchu Twn
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Chen I-kai
Institute Of Mechatronics Engineering National Taipei Universityof Technology
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Chen Coming
Specialty Technology Division United Microelectronics Corporation
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Chen Ying-jyh
Institute Of Mechatronics Engineering National Taipei Universityof Technology
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Huang Heng-sheng
Institute Of Mechatronics National Taipei University Of Technology
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Lin Shyn-jye
Institute Of Mechatronics Engineering National Taipei Universityof Technology
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Hong Gary
Specialty Techology Division United Microelectronics Corporation
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SU Jason
Institute of Mechatronics, National Taipei University of Technology
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LEE Dong-Lung
Institute of Mechatronics, National Taipei University of Technology
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LIN Chih-Hung
Specialty Technology Division, United Microelectronics Corporation
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TING Wen-Chi
Specialty Technology Division, United Microelectronics Corporation
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Huang Heng-sheng
Institute Of Mechatronics Engineering National Taipei Universityof Technology
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Chou J.
Specialty Techology Division United Microelectronics Corporation
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Chen Coming
Specialty Technology Division, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
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Hong Gary
Specialty Technology Division, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
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Huang Heng-Sheng
Institute of Mechatronic Engineering, National Taipei University of Technology, Taipei, Taiwan, R.O.C.
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Chou Jih-Wen
Specialty Technology Division, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
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Shiu Jen-Shiuan
Institute of Mechatronic Engineering, National Taipei University of Technology, Taipei, Taiwan, R.O.C.
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Lin Chih-Hung
Specialty Technology Division, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
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Ting Wen-Chi
Specialty Technology Division, United Microelectronics Corporation, Hsin-Chu, Taiwan, R.O.C.
著作論文
- A Capacitance Ratio Method Used for L_ Extraction of an Advanced Metal-Oxide-Semiconductor Device with Halo Implant
- Performance and Reliability Improvement of Low-Power Embedded Flash Memory with Shallow Trench Isolation Structure
- A Modified Capacitance–Voltage Method Used for $L_{\text{eff}}$ Extraction and Process Monitoring in Advanced 0.15 $\mu$m Complementary Metal-Oxide-Semiconductor Technology and Beyond
- Performance and Reliability Improvement of Low-Power Embedded Flash Memory with Shallow Trench Isolation Structure