Bourbon G | Univ. Franche Comte Besancon Fra
スポンサーリンク
概要
関連著者
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Moal Patrice
Laboratoire De Mecanique Appliquee R. Chaleat(lmarc):institut Des Microtechniques De Franche-comte
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Le Moai
Institut Des Microtechniques De Franche Comte Laboratoire De Mecanique Appliquee Universite De Franc
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Minotti P
Univ. Franche Comte Besancon Fra
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Bourbon G
Univ. Franche Comte Besancon Fra
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Joseph Eric
Laboratoire De Mecanique Appliquee R. Chaleat(lmarc):institut Des Microtechniques De Franche-comte
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Bourbon Gilles
Laboratoire De Mecanique Appliquee R. Chaleat(lmarc):institut Des Microtechniques De Franche-comte
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Langlet Philippe
3rd Department,Institute of Industrial Science, University of Tokyo
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MINOTTI Patrice
Institut des Microtechniques de Franche Comte, Laboratoire de Mecanique Appliquee, Universite de Fra
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JOSEPH Eric
Institut des Microtechniques de Franche Comte, Laboratoire de Mecanique Appliquee, Universite de Fra
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BOURBON Gilles
Institut des Microtechniques de Franche Comte, Laboratoire de Mecanique Appliquee, Universite de Fra
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Langlet Philippe
3rd Department Institute Of Industrial Science University Of Tokyo
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Masuzawa Takahisa
2nd Department Institute Of Industrial Science University Of Tokyo
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Minotti Patrice
Limms
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MASUZAWA Takahisa
CNRS-IIS, Institute of Inclustrial Science, University of Tokyo
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LE MOAL
Institut des Microtechniques de Franche Comte, Laboratoire de Mecanique Appliquee, Universite de Fra
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Le Moal
Institut des Microtechniques de Franche Comte, Laboratoire de Mecanique Appliquee
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MOAL Patrice
Laboratoire de Mecanique Appliquee R. Chaleat(LMARC)
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BOURBON Gilles
Laboratoire de Mecanique Appliquee R. Chaleat(LMARC)
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JOSEPH Eric
Laboratoire de Mecanique Appliquee R. Chaleat(LMARC)
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HIBERT Cyrille
EPFL Center of Micro-Nano Technology (CMI)
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MINOTTI Patrice
Laboratoire de Mecanique Appliquee R. Chaleat(LMARC)
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Minotti Patrice
Laboratoire De Mecanique Appliquee R. Chaleat (lmarc)
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Fujita H
3rd Department Institute Of Industrial Science University Of Tokyo
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Minotti Patrice
3rd Department, Institute of Industrial Science, University of Tokyo
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Bourbon Gilles
3rd Department, Institute of Industrial Science, University of Tokyo
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Helin Philippe
3rd Department, Institute of Industrial Science, University of Tokyo
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Masuzawa Takahisa
2nd Department, Institute of Industrial Science, University of Tokyo
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Fujita Hiroyuki
3rd Department, Institute of Industrial Science, University of Tokyo
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BOURBON Gilles
CNRS-IIS, Institute of Inclustrial Science, University of Tokyo
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LANGLET Philippe
LIMMS
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LANGLET Philippe
CNRS-IIS, Institute of Industrial Science, University of Tokyo
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BOURBON Gilles
LIMMS
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WALTER Vincent
Institut des Microtechniques de Franche Comte, Laboratoire de Mecanique Appliquee, Universite de Fra
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MOAL Patrice
Institut des Microtechniques de Franche Comte, Laboratoire de Mecanique Applique, Universiti de Fran
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Helin Philippe
3rd Department Institute Of Industrial Science University Of Tokyo
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Bourbon Gilles
3rd Department Institute Of Industrial Science University Of Tokyo
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Minotti Patrice
3rd Department Institute Of Industrial Science University Of Tokyo
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Walter Vincent
Institut Des Microtechniques De Franche Comte Laboratoire De Mecanique Appliquee Universite De Franc
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Fujita Hiroyuki
3rd Department Institute Of Industrial Science University Of Tokyo
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Helin Phillipe
3rd Department, Institute of Industrial Science, University of Tokyo
著作論文
- MMT-05 SILICON-BASED FLAPPING WINGS USING SELF-ACTUATED STRESS DISTRIBUTION
- (マイクロマシン)
- Toward New Cylindrical Electrostatic Micromotors Using Tubular Combination of Arrayed Direct-Drive Actuators
- Design and Characterization of High-Torque/Low-Speed Silicon Based Electrostatic Micromotors Using Stator/Rotor Contact Interactions
- Investigation of Output Mechanical Power Limits on High-Torque Electrostatic Actuators Using High-Frequency Complementary Metal Oxide Semiconductor (CMOS) Camera Combined With Image Processing Software : Semiconductors
- On-Chip Investigation of Torque/Speed Characteristics on New High-Torque Micrometer-Size Polysilicon Electrostatic Actuators : Semiconductors
- Toward Standard Method for Microelectromechanical Systems Material Measurement through On-Chip Electrostatic Probing of Micrometer Size Polysilicon Tensile Specimens : Surfaces, Interfaces, and Films