Evaluation of In-Plane Microdeformation Distribution Characteristics of Polishing Pad Surface
スポンサーリンク
概要
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In the chemical mechanical polishing (CMP) of a Si wafer, the physical properties of the polishing pad affect the processing characteristics. There have been several studies on the evaluation of pad surface asperity. In this study, we investigate the fundamental characteristics of polishing pads by the digital image correlation (DIC) method from two viewpoints. It was found that the pad surface deforms owing to shrinkage. Moreover, there is a strong relationship between the in-plane microdeformation characteristics and the amount of material removed from the pad in the conditioning process. Since the DIC method can measure changes in pad surface conditions, it can be used to evaluate future CMP monitoring systems.
- 2013-05-25
著者
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Uneda Michio
Department Of Mechanical Engineering Kanazawa Institute Of Technology
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Omote Tatsunori
Department of Mechanical Engineering, Kanazawa Institute of Technology, Nonoichi, Ishikawa 921-8501, Japan
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Ishikawa Ken-ichi
Department of Mechanical Engineering, Kanazawa Institute of Technology, Nonoichi, Ishikawa 921-8501, Japan
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Nakamura Yoshio
Fujikoshi Machinery Corporation, Matsushiro, Nagano 381-1233, Japan
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Shibuya Kazutaka
Fujikoshi Machinery Corporation, Matsushiro, Nagano 381-1233, Japan
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Ichikawa Daizo
Fujikoshi Machinery Corporation, Matsushiro, Nagano 381-1233, Japan
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