Surface Smoothing of Polycrystalline Substrates with Gas Cluster Ion Beams
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概要
- 論文の詳細を見る
The surface smoothing of polycrystalline materials is difficult owing to the etching rate dependence on crystalline orientation. In this study, surface smoothing with a gas cluster ion beam (GCIB) was studied in polycrystalline substrates such as poly-SiC (surface roughness, 0.3 nm) and yttrium aluminum garnet (YAG; surface roughness, 1.1 nm). Before irradiation, there were many scratches induced by mechanical polishing on poly-SiC. These scratches were removed after Ar-GCIB irradiation. Additional O2-GCIB irradiation for asperity removal showed improvement in the average roughness of poly-SiC to 0.3 nm. Similarly, the scratches on the as-polished surface of YAG disappeared and the YAG surface roughness decreased to 0.7 nm with Ar-GCIB irradiation without inducing an etching rate difference between grains. It was also shown that polycrystalline diamond or poly-Si films can be smoothed using GCIB. These results indicate that GCIB polishing is suitable for the surface planarization of polycrystalline materials.
- 2010-06-25
著者
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Isao Yamada
Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo 671-2280, Japan
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Yamada Isao
Graduate School of Engineering, University of Hyogo, 2167 Syosya, Himeji, Hyogo 671-2201, Japan
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Toyoda Noriaki
Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo 671-2201, Japan
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Mashita Takafumi
Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo 671-2280, Japan
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Yamada Isao
Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo 671-2201, Japan
関連論文
- Photoelectron Spectroscopy Study of the Valence Band Region in Diamond-Like Carbon Thin Films
- Surface Smoothing of Polycrystalline Substrates with Gas Cluster Ion Beams
- X-ray Photoelectron Spectroscopy Study of Diamond-Like Carbon Thin Films Formed by Ar Gas Cluster Ion Beam-Assisted Fullerene Deposition
- Development of Cu Etching Using O Cluster Ion Beam under Acetic Acid Gas Atmosphere (Special Issue : Dry Process)
- Gas Cluster Ion Beam Etching under Acetic Acid Vapor for Etch-Resistant Material
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- Gas Cluster Ion Beam Etching under Acetic Acid Vapor for Etch-Resistant Material (Special Issue : Dry Process)