Fundamental Study of the Mask Topography Effect on the Advanced Phase-Shifting Masks for Next-Generation Lithography
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概要
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Phase-shifting masks (PSMs) with trench- or mesa-type quartz etched structure are widely known as powerful resolution enhancement technologies for advanced lithography. For advanced PSMs, the feature size on a mask including a phase shifter is beyond the wavelength of the light source, and for such a sub-wavelength phase shifter, the impact of the mask topography effect on the amount of phase shifting and the light transmittance becomes prominent. However, an effective method of measuring the actual phase shifting and transmittance of such a tiny phase shifter has not yet been reported because of the difficulty in measuring the sub-wavelength structure. In this work, we have attempted to measure the actual transmittance and phase shifting using the assembled tiny phase shifter aperture array pattern, and we have successfully revealed the actual transmittance and phase shifting behavior of the tiny phase shifter depending on its feature size and trench depth.
- 2010-06-25
著者
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Misaka Akio
Ulsi Process Technology Development Center Matsushita Electronics Corporation
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Sasago Masaru
Ulsi Process Technology Development Center Semiconductor Company Matsushita Electronics Corporation
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Masaru Sasago
ULSI Process Technology Development Center, Corporate Manufacturing Division, Semiconductor Company, Panasonic Corporation, Nagaokakyo, Kyoto 617-8520, Japan
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Takashi Yuito
ULSI Process Technology Development Center, Corporate Manufacturing Division, Semiconductor Company, Panasonic Corporation, Nagaokakyo, Kyoto 617-8520, Japan
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Yuito Takashi
ULSI Process Technology Development Center, Corporate Manufacturing Division, Semiconductor Company, Panasonic Corporation, Nagaokakyo, Kyoto 617-8520, Japan
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Akio Misaka
ULSI Process Technology Development Center, Corporate Manufacturing Division, Semiconductor Company, Panasonic Corporation, Nagaokakyo, Kyoto 617-8520, Japan
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- Fundamental Study of the Mask Topography Effect on the Advanced Phase-Shifting Masks for Next-Generation Lithography