Degradation of Electromigration Lifetime of Cu/Low-$k$ Interconnects by Postannealing

スポンサーリンク

概要

• 論文の詳細を見る

• The total thermal budget of the wafer fabrication process for structures with multilevel Cu/low-$k$ interconnects has been increasing, and its effect on the electromigration (EM) reliability of the lower-level interconnects has become a concern. The annealing of packaged samples including two-level interconnects for EM tests was shown here to be an effective method of evaluating the effect of the thermal budget on interconnects. EM lifetime was reduced by postannealing at the maximum process temperature (350 °C), and its failure mode was a slitlike void generated at the interface between the via and the Cu line. It was shown that the degradation mechanism was related to the contact between the via and the Cu line and that postannealing may affect the stress at this contact by changing the stress in the dielectric interlayer film.

• 2009-04-25

著者

• UENO Kazuyoshi

  Department of Neurosurgery,Hokkaido University School of Medicine

• Kakuhara Yumi

  Advanced Device Development Division, NEC Electronics Corporation, Sagamihara, Kanagawa 229-1198, Japan

• Kakuhara Yumi

  Advanced Device Development Division, NEC Electronics Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan

• Ueno Kazuyoshi

  Department of Electronic Engineering, Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan

• Ueno Kazuyoshi

  Department of Electronic Engineering, Shibaura Institute of Technology, Tokyo 135-8548, Japan

関連論文

• 21. Acoustic Nerve Tumor : -An analysis of symptoms and sings in an attempt to establish early diagnosis-
• Suppression of Electromigration Early Failure of Cu/Porous Low-$k$ Interconnects Using Dummy Metal
• Comparison of Lifetime Improvements in Electromigration between Ti Barrier Metal and Chemical Vapor Deposition Co Capping
• Degradation of Electromigration Lifetime of Cu/Low-$k$ Interconnects by Postannealing
• Electromigration Lifetime Enhancement of CoWP Capped Cu Interconnects by Thermal Treatment

スポンサーリンク