Cantilever Fabrication by Force-Free Release Transfer
スポンサーリンク
概要
- 論文の詳細を見る
Microstructures on a dummy substrate are bonded and transferred to the main substrate in a transfer process. The novel transfer process is developed using a new release layer on the dummy substrate. The release layer consists of a TiO2 layer and a poly(methyl methacrylate) (PMMA) film. Although the dummy substrate sticks to the main substrate after the bonding, the dummy substrate can be separated from the main substrate without using a pulling force by the UV exposure of the release layer. The force-free release can be obtained by PMMA film degradation by UV exposure. A cantilever with long beams (up to 1000 μm) and a wide base ($5\times 3$ mm2) is successfully fabricated by the new transfer process.
- 2008-06-25
著者
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HIRAI Yoshihiko
Graduate School of Engineering, Osaka Prefecture University
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Kawata Hiroaki
Graduate School of Engineering, Osaka Prefecture University, 1-1 Gakuen-cho, Naka-ku, Sakai 599-8531, Japan
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Yasuda Masaaki
Graduate School of Engineering, Osaka Prefecture University, 1-1 Gakuen-cho, Naka-ku, Sakai 599-8531, Japan
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Ryugou Kenichi
Graduate School of Engineering, Osaka Prefecture University, 1-1 Gakuen-cho, Naka-ku, Sakai 599-8531, Japan
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Ohta Saki
Graduate School of Engineering, Osaka Prefecture University, 1-1 Gakuen-cho, Naka-ku, Sakai 599-8531, Japan
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