Strain Distribution around SiO2/Si Interface in Si Nanowires: A Molecular Dynamics Study
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概要
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We have performed three-dimensional molecular dynamics simulations to investigate strain and stress distributions in silicon nanostructures covered with thermal oxide films, by using our original molecular force field for Si, O mixed systems. We have modeled a wire-shaped nanostructure by carving a Si(001) substrate, and then an oxide film with a uniform thickness was formed by inserting oxygen atom into Si–Si bonds from the surface. The simulation results show that a compressive stress is concentrated on the oxide region in the vicinity of the side SiO2/Si interface of the nanowire. At the top interface, there is also a compressive stress in the [110] direction, whereas the [001] component of the normal stress tensor is almost relaxed. These results suggest that the oxidation is strongly suppressed at the side faces of the silicon nanowire.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2007-05-30
著者
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OHTA Hiromichi
Faculty of Engineering, Ibaragi University
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Ohdomari Iwao
Institute for Nanoscience and Nanotechnology, Waseda University, Tokyo 169-8555, Japan
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Watanabe Takanobu
Institute for Nanoscience and Nanotechnology, Waseda University, Tokyo 169-8555, Japan
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Ohta Hiromichi
Faculty of Science and Engineering, Waseda University, Tokyo 169-8555, Japan
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Watanabe Takanobu
Institute for Nanoscience and Nanotechnology, Waseda University, Shinjuku, Tokyo 169-8555, Japan
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