The Leakage Current Conduction Mechanisms of Cu/Porous Silica Damascene Schemes with Nano-cluster TaSix Barrier
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概要
- 論文の詳細を見る
Leakage current conduction mechanisms of Cu/porous silica damascene structures with TaSix (20 nm) barrier were investigated. Polycrystalline TaSi0.54 and nano-cluster TaSi0.42 barriers were prepared by dc sputtering with various power and pressure. The newly developed silica based slurry was employed for the metal-CMP of TaSix films. The incorporation of traditional NH4OH solution and megasonic were applied to perform post-CMP cleaning. Auger mapping revealed clearly straight Cu and Ta lines in these TaSix samples. The line-to-line leakage current density ($J_{\text{L}}$) was plotted versus the electric field ($E$) at various temperatures. The Ln($J_{\text{L}}$)–$(E)^{1/2}$ plots showed that Ln($J_{\text{L}}$) is linearly dependent on $(E)^{1/2}$, corresponding to Schottky emission mechanism. The slope of straight lines were determined from the data points of the Ln($J_{\text{L}}/T^{2}$)–($1000/T$) plots. It revealed the magnitude of barrier height. The maximum height of the potential barrier of nano-cluster TaSix/porous silica is about 0.12–0.30 eV. The bias-temperature-stress induced leakage current was measured for reliability study.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-01-15
著者
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Chen Chung-hsien
Department Of Engineering And System Science National Tsing Hua University
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Chang Chin-Piao
Department of Electrical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan
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Huang Fon-Shan
Institute of Electronics Engineering, National Tsing Hua University, Hsinchu 300, Taiwan
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Chen Chung-Hsien
Department of Electrical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan
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Huang Fon-Shan
Institute of Electronics Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Road, Hsinchu 30013, Taiwan
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