A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea
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概要
- 論文の詳細を見る
Thiourea is a well-known additive in the electroplating industry due to its excellent ability to reduce surface roughness. However, sulfur dissociated from the thiourea is often incorporated into the plated Cu film as the byproduct CuS, which then increases the film's resistivity. The two-step Cu electroplating method proposed here deposited a smoother Cu surface film and matched the resistivity (after annealing) attained using methods that employ a thiourea-free electroplating of the Cu film. The Cu film obtained through two-step plating contained a sulfur concentration that was below the detection limit of Auger electron spectroscopy (AES).
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-11-15
著者
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Kang Moo
Research Center For Energy Conversion And Storage School Of Chemical Engineering Seoul National Univ
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Kim Jae
Research Center For Energy Conversion And Storage School Of Chemical Engineering College Of Engineer
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Kim Soo-Kil
Research Center for Energy Conversion and Storage, School of Chemical Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-gu, Seoul 151-742, Korea
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Kim Jae
Research Center for Energy Conversion and Storage, School of Chemical Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-gu, Seoul 151-742, Korea
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