Optimized Surface Treatment of Indium Tin Oxide (ITO) for Copper Electroless Plating
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概要
- 論文の詳細を見る
Electrolessly plated Cu film on indium tin oxide (ITO) substrate was studied for the application of the data bus line in large scale liquid crystal display (LCD) and plasma display panel (PDP). The optimized surface treatment of ITO substrate was extensively investigated. The two-step pretreatment of Sn sensitization and Pd activation resulted in the best results. Using the optimized treatment, the electrolessly plated Cu film with (100) and (200) preferred orientation showed 7 nm root mean square (RMS) roughness, as-deposited 2.2 μΩ・cm resistivity, good adhesion and excellent selectivity.
- 社団法人応用物理学会の論文
- 2002-11-01
著者
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Cha Seung
Research Center For Energy Conversion And Storage School Of Chemical Engineering College Of Engineer
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KIM Jae
Research Institute of Computer, Information and Communication, Pusan National University
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Kim Jae
Research Center For Energy Conversion And Storage School Of Chemical Engineering College Of Engineer
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Kim Jae
Research Center For Energy Conversion And Storage School Of Chemical Engineering College Of Engineer
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Cha Seung
Research Center For Energy Conversion And Storage School Of Chemical Engineering College Of Engineer
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- Optimized Surface Treatment of Indium Tin Oxide (ITO) for Copper Electroless Plating
- Seedless Fill-Up of the Damascene Structure Only by Copper Electroless Plating
- Wide-Viewing-Angle Transflective Display Associated with a Fringe-Field Driven Homogeneously Aligned Nematic Liquid Crystal Display
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- A Multimode-Type Transflective Liquid Crystal Display Using the Hybrid-Aligned Nematic and Parallel-Rubbed Vertically Aligned Modes
- A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd Activation
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