A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd Activation
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概要
- 論文の詳細を見る
Surface modification using the two-step wet activation method consisting of Sn sensitization and Pd activation was introduced to Cu electrodeposition on indium tin oxide (ITO). Pd particles formed on the ITO surface through two-step Sn-Pd activation mediated the electron transfer at the interface and resulted in high-density instantaneous nucleation. Unlike the sparse cluster-type deposits on bare ITO, Cu electrodeposition on Sn-Pd activated ITO enabled the deposition of bright, continuous, and (111)-predominant Cu films on seedless ITO substrate.
- Japan Society of Applied Physicsの論文
- 2003-09-15
著者
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Kim Jae
Research Center For Energy Conversion And Storage School Of Chemical Engineering College Of Engineer
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Kim Yong
Research Center For Energy Conversion And Storage School Of Chemical Engineering Seoul National Univ
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Kim Soo-Kil
Research Center for Energy Conversion and Storage, School of Chemical Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-gu, Seoul 151-742, Korea
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Kim Jae
Research Center for Energy Conversion and Storage, School of Chemical Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-gu, Seoul 151-742, Korea
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Kim Yong
Research Center for Energy Conversion and Storage, School of Chemical Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-gu, Seoul 151-742, Korea
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