Parameters and Stability Analysis of Reactive Sputtering

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概要

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• Based on Berg’s model for reactive sputtering, several nondimensional parameters and ratios are first identified in line with their physical significance. These parameters and ratios are subsequently used to analyze the steady-state solutions of reactive sputtering in detail. Results show that, when the chemical reaction in the substrate is moderate, the lower sputter yield of a compound enhances the hysteresis loop at higher inflow rates. However, when the ratio of sputtering yield (compound/metal) is zero, there is no hysteresis transition because of the deposition of pure metal (single phase) on the substrate. Hysteresis is influenced by pumping speed and a stability criterion is established based on the segment of s curve with negative slope. From the criterion, two turning points for the hysteresis loop can be easily found either graphically or algebraically.

• 2003-10-15

著者

• HSIEH Jang-Hsing

  School of Mechanical and Production Engineering, Nanyang Technological University

• Li Chuan

  School Of Mechanical And Production Engineering Nanyang Technological University

• Li Chuan

  School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Ave. 639798, Singapore

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• Calculation of Sputtering Rate during a Plasma-Assisted Process
• Parameters and Stability Analysis of Reactive Sputtering
• Depth Profiling of Si Oxidation States in Si-Implanted SiO2 Films by X-Ray Photoelectron Spectroscopy

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