Bonding Technology of Semiconductor Film on Piezoelectric Substrate Using Epitaxial Lift-Off Technology
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概要
- 論文の詳細を見る
In this paper, we report the results of a study on the basic problems of the mass production of epitaxial liftoff (ELO) film bonding technology. We propose a new releasing method for a large number of semiconductor films using polyimide to protect the semiconductor films. We investigated the basic process conditions and successfully released a large number of stripe shaped GaAs films. We also studied the heating method for enhancing the bonding strength between a small-sized semiconductor film and a piezoelectric substrate. We investigated the effect of migration of water molecules from the bonding interfaces using microwave and laser irradiation. We estimated the crystallinity of semiconductor films by X-ray diffraction. The results clarified that these processes were effective in improving mass productivity on the fabrication technology of surface acoustic wave (SAW)-semiconductor coupled devices.
- Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
- 2001-05-30
著者
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Koh Keishin
Department Of Electronic & Electrical Engineering Kanagawa Institute Of Technology
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Hohkawa Kohji
Department Of Electrical & Electric Engineering Kanagawa Institute Of Technology
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KANESHIRO Chinami
Department of Electrical & Electric Engineering, Kanagawa Institute of Technology
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MIYADAI Kenichiro
Department of Electrical and Electronic Engineering, Kanagawa Institute of Technology
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Noge Satoru
Department Of Electrical And Electronic Engineering Kanagawa Institute Of Technology
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Aoki Yusuke
Department Of Applied Physics Nagoya University
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Hong Chulun
Department Of Electrical & Electronic Engineering Kanagawa Institute Of Technology
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Miyadai Kenichiro
Department of Electrical and Electronic Engineering, Kanagawa Institute of Technology, 1030 Shimo-ogino, Atsugi, Kanagawa 243-0292, Japan
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Koh Keishin
Department of Electrical & Electric Engineering, Kanagawa Institute of Technology, 1030 Shimo-Ogino, Atsugi-shi, Kanagawa 243-0292, Japan
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Hohkawa Kohji
Department of Electrical and Electronic Engineering, Kanagawa Institute of Technology, 1030 Shimo-ogino, Atsugi, Kanagawa 243-0292, Japan
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Hong Chulun
Department of Electrical and Electronic Engineering, Kanagawa Institute of Technology, 1030 Shimo-ogino, Atsugi, Kanagawa 243-0292, Japan
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