Atmospheric Pressure Remote Plasma Ashing of Photoresist Using Pin-To-Plate Dielectric Barrier Discharge

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概要

• 論文の詳細を見る

• Plasma ashing of photoresist (PR) was investigated with N2/O2/SF6 gas mixtures using remote-type atmospheric pressure plasma generated by a pin-to-plate type dielectric barrier discharge. When a certain amount of O2 and SF6 were added together to N2, higher PR ashing achieved at N2 (70 slm)/O2 (200 sccm)/SF6 (3 slm).

• Japan Society of Applied Physicsの論文
• 2007-10-25

著者

• Yeom Geunyoung

  Department of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 440-746, South Korea

• Park Jaebeom

  Department of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 440-746, South Korea

• Kyung Sejin

  Department of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 440-746, South Korea

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• Atmospheric Pressure Remote Plasma Ashing of Photoresist Using Pin-To-Plate Dielectric Barrier Discharge

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