Processing Strategies for Protecting Integrated Circuit Pattern from Damage Due to a Dicing Saw Blade

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概要

• 論文の詳細を見る

• In the present study, in order to protect the integrated circuit (IC) patterns from the impact due to a dicing saw blade, the pattern layers on the scribe regions of a semiconductor wafer are selectively removed and so, their bare silicon surfaces are exposed therein. The scribe regions (where the layers are absent) are then replaced by polyimide prior to the wafer dicing process. Since the polyimide film has a considerably larger adhesion strength with the silicon surface than other pattern layers or plastic-encapsulants have, it effectively accommodates the impact of the saw blade. According to the experimental results, the IC devices having discontinuous layers on the scribe regions exhibit excellent thermal cycling reliability, regardless of dicing process conditions.

• Japan Society of Applied Physicsの論文
• 2004-08-15

著者

• Lee Seong-Min

  Department of Materials Engineering, Kangwon National University

• Lee Seong-Min

  Department of Materials Science & Engineering, University of Incheon, 177 Dohwa-dong, Nam-ku, Incheon, 402-749, South Korea

関連論文

• Thermal-Stress-Induced Failure in Memory Device Assembled Using Lead-on-Chip Die Attach Technique(Structure and Mechanical and Thermal Properties of Condensed Matter)
• The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices
• Processing Strategies for Protecting Integrated Circuit Pattern from Damage Due to a Dicing Saw Blade

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