Thermal-Stress-Induced Failure in Memory Device Assembled Using Lead-on-Chip Die Attach Technique(Structure and Mechanical and Thermal Properties of Condensed Matter)

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概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 2002-06-15

著者

• Lee S‐m

  Department Of Materials Science And Engineering University Of Incheon

• Lee Seong-min

  Department Of Materials Science & Engineering University Of Incheon

• Lee Seong-Min

  Department of Materials Engineering, Kangwon National University

関連論文

• Thermal-Stress-Induced Failure in Memory Device Assembled Using Lead-on-Chip Die Attach Technique(Structure and Mechanical and Thermal Properties of Condensed Matter)
• The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices
• Processing Strategies for Protecting Integrated Circuit Pattern from Damage Due to a Dicing Saw Blade

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