Lee Seong-Min | Department of Materials Engineering, Kangwon National University
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概要
関連著者
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Lee Seong-Min
Department of Materials Engineering, Kangwon National University
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Lee S‐m
Department Of Materials Science And Engineering University Of Incheon
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Lee Seong-min
Department Of Materials Science & Engineering University Of Incheon
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Lee Seong-Min
Department of Materials Science & Engineering, University of Incheon, 177 Dohwa-dong, Nam-ku, Incheon, 402-749, South Korea
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Lee Seong-Min
Department of Materials Science and Engineering, University of Incheon, 177 Dohwa-dong, Nam-ku, Incheon, 402-749, South Korea
著作論文
- Thermal-Stress-Induced Failure in Memory Device Assembled Using Lead-on-Chip Die Attach Technique(Structure and Mechanical and Thermal Properties of Condensed Matter)
- The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices
- Processing Strategies for Protecting Integrated Circuit Pattern from Damage Due to a Dicing Saw Blade