X線リソグラフィを利用した高効率高精度微細ふるいの研究

概要

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Possibility of high throughput and high accurate sieving has been studied using X-ray lithography and electroforming. Our idea is to design tapered apertures in mesh of the sieve using three dimensional machining of X-ray lithography. The tilt exposing was done in X-ray lithography for the tapered aperture. It is demonstrated to achieve high throughput sieving of 10.5 g/hr using the tapered apertures and high opening rate of 44 % in the proposed mesh, while only electroforming and both UV lithography and electroforming have sieving of 0 and 5.1 g/hr in opening rate of 9 and 25 %, respectively. Furthermore, it is demonstrated that a deviation of the aperture size fabricated by X-ray lithography and electroforming is very small compared with other methods of only electroforming and both UV lithography and electroforming.