A Module Design Approach Using Structural and Functional Modeling for Distributed Consumer Electronics Design Project

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This paper describes the utilization of the product model by SysML as a joint platform for distributed design. We introduce a typical design process involving distributed design teams. In particular, this process allows a thermal design of cavities, i.e., air space inside the enclosure, in terms of flow rate, acoustic radiation resistance and so on. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. Authors propose structural and functional modeling that enables all the distributed design sites to share the design information with the product model. Using this design framework, it will be possible to prevent performance defects due to physical coupling between modules, and thus, reduce the iteration of work.