堅型連続電気めっき槽における一次電流分布

概要

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Recent developments in continuous-strip electroplating processes concern two main features-“high current density operation” and “alloy plating technology”. Current distribution on the cathode strip in a vertical cell is mainly governed by the high ohmic voltage drop in the substrate strip and also plating electrolyte between anode and strip in comparison with electrochemical overpotentials, provided that gas-bubble purging and limited mass-transfer problems are resolved be the use of well designed plating cells. Dependence of alloy content and/or phase on plating current density assures a minimum of variation of current density in a cell. Primary current distributions in vertical plating cells in both the longitudinal and transverse directions were calculated by simplified numerical analysis. Unidirectional current flow is the key assumption in this study, which eliminates the use of Laplaces partial differential equation, based on the particular cell geometry of industrial vertical plating cells. Longitudinal current distribution depends on the ratio of the ohmic resistance of the cathode strip to that induced by the electrolyte in the anode-to-strip gap. Transverse current distribution depends on variations in the anode-to-strip gap across the strip width.
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