回転円筒電極による銅めっきの研究

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The effects of stirring on the electroplating of copper have been investigated in an aqueous CuSO4-H2SO4 solution using a cylindrical cell in which the inner cathode was rotated and the outer anode was fixed.The discharge mechanism of cupric ion was found to be independent of overpotential and rotation speed under the limiting current density. The morphology of the copper deposit was little influenced by rotation speed when cathodic overpotential was lower than -0.16V. At high overpotential (|η|>0.33V), the surface of the deposit became smooth as the rotation speed increased under laminar flow conditions, whereas under turbulent flow conditions smooth deposits were always observed even at 70A/dm2 due to a remarkable decrease in the thickness of the diffusion layer.The preferred orientation of the {110} plane appears only at high rotation speeds owing to the acceleration of nucleation, especially at an overpotential of -0.33V. No characteristic preferred orientation appeared under laminar flow conditions.
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