ニッケルめっき膜の引張応力に及ぼす共析水素による2-ブチン-1,4-ジオール水素化の影響

概要

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The hydrogenation of brightener 2-butyne-1,4-diol at nickel electroplating from a Watts-type bath was investigated. The amount of hydrogen gas evolved during electroplating was in-situ evaluated quantitatively on the basis of buoyancy produced by hydrogen gas using an electric balance. The variation of the internal strain in nickel films plated with the addition of 2-butyne-1,4-diol was measured using a resistance wire-type strain gauge placed on the reverse side of the copper substrate.The hydrogenation of 2-butyne-1,4-diol progressed easily on as-deposited nickel substrate compared with the commercial copper and nickel substrates, and the hydrogenation of 2-butyne-1,4-diol was always preferred to the formation of hydrogen gas during nickel electroplating. The 2-butyne-1,4-diol adsorbed on as-deposited nickel electrode was hydrogenated catalytically by hydrogen co-deposited with nickel on the electrode. The hydrogenation of 2-butyne-1,4-diol might bring about the formation of internal tensile stress in the nickel deposits during electroplating.
2006-10-01