液晶ディスプレイパネルの高密度接続技術

概要

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High density bonding technology with 320 soldered joints for switching LCD (Liquid Crystal Display) panels and ceramic substrates was investigated, where pitch of the bonding pad being 192 μm.<BR>Controlled Flow Bonding (CFB) process was applied to the bonding of LCD panels. To minimize the bonding failures due to the difference in thermal expansion, flexible printed cable (FPC) was divided into 20 mm width subparts.<BR>Adhesion strength of bonding joints was obtained to be 6 gf. After 500 cycles of thermal cycle test, adhesion strength decreased to 35% of the initial value. This, however, is considered not to cause any electrical problems because resistance of bonding joints was unchanged during this test.<BR>A new CFB process for bonding FPC to warped ceramic substrates was proposed. By using magnets and a thin magnetic plate, we succeeded the solder bonding of FPC to warped ceramic substrates with warp up to 230 μm.
日本真空協会の論文