2312 表面貼付型ICチップ冷却網形態の設計法(OS6-3 設計と最適化III-トポロジー設計-,OS6 設計と最適化)

概要

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IC chips are used in almost all modern electronic devices, such as computers and cell phones, and are essential for our lives. But the IC chip temperature rises steeply caused by the downsizing of IC chips and high density of circuits. So countermeasures against heating up are one of the important issues for the IC chips because the increased IC chip temperature causes malfunction. However, the traditional countermeasures such as the cooling fan and the heat sink of regular pattern have a limitation in their cooling performance. So we have focused on the cooling channel with superior cooling performance. In this report, a design method of cooling pathway by utilizing the optimality of branching system has been suggested because it is said that branching system in nature is optimum structures for many purposes. And the cooling performances of the proposed design method have been evaluated from both methods of CAE simulation and an experiment, and by comparing the results of the conventional design method.
一般社団法人日本機械学会の論文
2011-10-21