552 セラミック-金属接合体強度に及ぼす金属側界面端形状の影響(接着接合の力業)

概要

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The focus of this study is to clarify effects of interface wedge condition in Metal side on the bonding strength of ceramic to metal joint. Each plate Si_3N_4 and Ni used for this experiment is produced by wire electric discharge machining. Geometrical interface shape at the edge of the interface is characterized by wedge angle in both sides of the ceramic and metal defined as a configuration angle between free surface of each material and the interface. As the wedge angle of Si_3N_4 is right angle, the wedge angle of Ni is set over 30°≤φ_2≤180°. Each specimen was bonded at 1253 K by using braze metal of 0.5mm thickness under vacuum and slowly cooled. The tensile strength of Si_3N_4 to Ni joint was evaluated under constant cross-head speed of 1.0mm/min at room temperature. Experimental Results showed that maximum tensile bonding strength was observed at the wedge angles of φ_2=75°. It seems that this geometrical condition is critical conditions of the bonding strength and fracture pattern. Setting φ_2 near 75° improves the bonding strength since it decreases the residual stress near edge of the interface on ceramic side. This paper provides a useful geometrical interface shape to improve tensile bonding strength of ceramic to metal joint.
2010-10-23