C11 Effect of Fullerene Poly-hydroxide on Cu-CMP Process(Abrasive finishing technology)
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概要
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A novel CMP process using poly-hydroxylated fullerene (C_<60>(OH)_<36>) is proposed. It has been previously reported that a copper surface can be improved considerably using C_<60>(OH)_<36> molecules as abrasive grains. In this report, the chemical effect of fullerene hydroxide C_<60>(OH)_<36> used for the CMP process is discussed. It was found that a copper-C_<60>(OH)_<36> complex layer is formed by the reaction of hydrogen peroxide and C_<60>(OH)_<36>; the removal of this layer is the removal mechanism of matter using fullerene poly-hydroxide used in the Cu-CMP process.
- 2009-12-01
著者
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KOKUBO KEN
Division of Applied Chemistry, Graduate School of Engineering, Osaka University
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Takaya Yasuhiro
Department of Mechanical Engineering and Systems, Osaka University
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Kokubo Ken
Division Of Applied Chemistry Graduate School Of Engineering Osaka University
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Takaya Yasuhiro
Department Of Mechanical Engineering And Systems Graduate School Of Engineering Osaka University
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Hayashi Terutake
Department Of Mechanical Engineering Osaka University
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Hayashi Terutake
Department Of Mechanical Engineering And Systems Graduate School Of Engineering Osaka University
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KISHIDA Hirotaka
Department of Mechanical Engineering and Systems, Graduate school of Engineering, Osaka University
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SUZUKI Keisuke
Nitta Haas Incorporated
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Kishida Hirotaka
Department Of Mechanical Engineering And Systems Graduate School Of Engineering Osaka University
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