くさび型接着接合を用いた精密装置用高剛性基礎の開発(構造)

概要

論文の詳細を見る
In the most advanced manufacturing facilities, required environmental specifications are become strictly and more complex. We proposed brand-new high rigid pedestal flooring for precision device such as photolithography equipment. The foundations are adhesively-bonded with cuneal steel chips, so that a high positioning accuracy can be achieved easily. A high stiffness and a high strength of the binding site are shown. All materials employed in the foundations are free from chemical contamination, which is one of the big problems for producing defectives in the clean rooms.
社団法人日本建築学会の論文
2009-02-20