220 超微粒ダイヤモンドホイールによる超精密研削加工(OS-6 超精密加工)

概要

論文の詳細を見る
Recent technological advances in the Electric Technology industry have created an acute demand for high-speed, high-performance, high-function, miniaturized electronic devices. In response to this demand, rapid advances are being made in the development of thin line and 3D lamination technologies. As a result, the need has been expressed for the introduction of the following in the processing of Si wafers that will become substrates ; 1) improved shape accuracy, 2) improved surface roughness, 3) reduced damage depth, 4) reduced environmental impact. Under such conditions, in order to realize high accuracy processing and reduce the environmental impact, grinding processing based on ultra-fine diamond grains wheel using a new vitrified bond that excels in gripping strength of abrasive was studied.
一般社団法人日本機械学会の論文
2006-11-24