1851 ビルドアップ基板の寿命推定技術 : ビルドアップ絶縁材料の熱酸化と強度低下(J09-3 プリント基板接続信頼性,J09 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

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Mechanical characteristic of build-up material was evaluated by the tensile test. Stress-strain behavior was examined at various temperatures. It has been understood that the build-up material shows a brittle fracture at low temperature. In addition, it has been understood that low temperature strength decreases greatly by thermal oxidation at high temperature storage. The FT-IR spectrum analyses clarified that the cause of the strength degradation was an increase of carbon-oxygen double bond during the thermal oxidation process. Based on the mechanism of thermal oxidation, the strength degradation behavior was formulated by an expression based on Arrhenius rule.
2005-09-18