フロリナートによる高出力ICチップの液体冷却に関する実験的研究

概要

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Fluorinert cooling of high-power IC chips using a closed type thermosyphon loop is investigated fundamentally to cope with the recent rapid rise in heat dissipation density of notebook computers. The present experimental set-up consists of evaporator and condenser sections connected by flexible tubing. The evaporator section corresponds to a high-power IC chip, and the condenser section represents a cooling plate located behind a display of notebook computers. The evaporator has the size of 50mm×50mm×20mm outside dimensions, and the condenser is made of a copper plate with heat transfer area of 150×200mm^2 and thickness of 1.5mm. The effects of the heat input, the filled volume of Fluorinert liquid and the inclination angle of condenser on the heat transfer characteristics of the system are studied experimentally.
九州大学の論文
1999-12-24