E215 モデルパッケージの熱伝達特性(オーガナイズドセッション21 : 電子機器の熱設計と解析の応用)

概要

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This paper reports on heat transfer behavior of an electronic chip module cooled by air. A standard electronic module package comprising of a single model package placed oh a PCB located in a rectangular duct has been designed and manufactured. Three small fans of the type used in laptop computers are located downstream of the electronic module sucking the cooling air over the board. The model packages used by the present experiment are PBGA model and isothermal model. The PBGA model package has a built-in diode for measurement of the chip temperature. The isothermal model package is composed of two copper plates sandwiching a foil heater. Both natural convection flow and forced flow are considered by turning the fans on and off and in various combinations. The Nusselt numbers for the isothermal model are obtained by evaluating the convective heat rate and the data are compared with the results for the PBGA model and existing correlations.
一般社団法人日本機械学会の論文
2001-11-03