低温プラズマ処理を利用したプリント基板材料用PPO樹脂の銅めっき密着性向上に関する研究

概要

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An investigation was performed on the inter facial control between polyphenyleneoxide (PPO) resin and copper conductor with a low temperature plasma treatment in order to find a new method for fabricating an insulation layer and a conductor layer. Various plasma treatments on the surface of PPO resin plate were carried out with three kinds of oxygen gas, nitrogen gas and argon gas under the constant treatment condition of pressure 30 Pa, power 50W and time 600s. The interfacial strength between PPO resin and copper plating was estimated by the peel test method. Furthermore, an XPS analysis and an AFM observation were carried out to investigate the surface characteristics of PPO resin. As a result, it was found that their surface energy largely increased, and functional groups (carboxyl group, hydroxyl group, carbonyl group) were formed on the surface after all plasma treatments. The peel strengths after plasma treatments were increased and the surface energy and these peel strengths showed a linear relation. And also, it became clear that the skewness value of surface roughness is an effective parameter for evaluating the peel strength of copper plating in the case of surface characterization formed by plasma etching.
社団法人日本機械学会の論文
2004-01-25