Profile and Surface Measurement Tool for High Aspect-ratio Microstructures(<Special Issue>Advances in Motion and Vibration Control Technology)

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概要

• 論文の詳細を見る

• A MEMS device for the profile measurement of high aspect-ratio microstructures has been developed. The goal was to implement a method to be used when the conventional methods were inappropriate. The main part of the tool is a silicon microprobe with a sharp tip at its end and an integrated piezoresistive strain gauge sensor. The probes are from 500μm to 1 mm long with a cross section area of 20×20 μm^2; they were mainly designed for the characterization of narrow and deep "EDM" micromachined micro-holes having a radius as small as 50 μm and a depth up to 800 μm. The profile measurement method has been extended to the characterization of several other microstructures. The measurement accuracy is about ±30 nm.

• 一般社団法人日本機械学会の論文
• 2003-09-15

著者

• Jalabert Laurent

  Cnrs-iis And Cirmm University Of Tokyo

• Jalabert Laurent

  Limms/cnrs-iis And Cirmm University Of Tokyo

• Masuzawa Takahisa

  LIMMS

• Pourciel Jean-bernard

  Limms

関連論文

• PROFILE AND SURFACE MEASUREMENT TOOL FOR HIGH ASPECT-RATIO MICROSTRUCTURES
• Profile and Surface Measurement Tool for High Aspect-ratio Microstructures(Advances in Motion and Vibration Control Technology)
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