Effects of Tungsten Polycidation on the Hot-Carrier Degradation in Buried-Channel LDD p-MOSFET's
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概要
- 論文の詳細を見る
Hot-carrier immunity of LDD buried-channel p-MOSFET's is severely degraded following tungsten polycidation of device gate and incorporation of F in the oxide, in contrast to the reliability enhancement commonly observed for n-MOSFET's. Possible mechanisms involving enhanced trapping at F-related oxide bulk traps and reduced field-induced detrapping rate are discussed. The reduction in hot-carrier reliability of WSi_x gate p-MOSFET's may raise concern over the use of WF_6-based tungsten polycide technology in deep submicrometer CMOS circuits.
- 社団法人応用物理学会の論文
- 1996-12-01
著者
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Ling C.
Department Of Electrical Engineering National University Of Singapore
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Ling C.h.
Department Of Electrical Engineering National University Of Singapore
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ANG D.
Department of Electrical Engineering, National University of Singapore
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Ang D.
Department Of Electrical Engineering National University Of Singapore
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Ang D.S.
Department of Electrical Engineering, National University of Singapore
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- Effects of Tungsten Polycidation on the Hot-Carrier Degradation in Buried-Channel LDD p-MOSFET's