Measurement of Parameters for Simulation of 193 nm Lithography Using Fourier Transform Infrared Baking System
スポンサーリンク
概要
- 論文の詳細を見る
By incorporating baking equipment into a Fourier transform infrared (FT-IR) spectrometer, a deprotection reaction parameter measurement system that can be used with chemically amplified resists has been developed. This system allows us to study new models for chemically amplified (CA) resists by including into a conventional deprotection reaction model an initial delay effect and a quencher effect. This model is also used to measure deprotection reaction parameters. The parameters thus obtained are inputted into a lithography simulator PROLITH/2 to perform profile simulations. The results are compared with those of scanning electron microscope (SEM) observations. Although the simulation results and SEM observations are not in complete agreement, the general trends observed are in adequate agreement. These results confirm the applicability of the proposed model to CA resists for ArF excimer laser lithography and verify the usefulness of the measurement system.
- 社団法人応用物理学会の論文
- 1999-08-15
著者
-
MATSUZAWA Toshiharu
Litho Tech Japan Corporation
-
Sekiguchi Atsushi
Litho Tech Japan Corp.
-
ISONO Mariko
Litho Tech Japan Corp.
-
Isono M
Litho Tech Japan Corp. Saitama Jpn
-
Matsuzawa T
Litho Tech Japan Corp. Saitama Jpn
-
Sekiguchi Atsushi
Litho Tech Japan Corp
-
Matsuzawa Toshiharu
Litho Tech Japan Corp
関連論文
- Development of Photochemical Analysis System for F_2-Excimer Laser Lithography Processes
- Study of Deprotection Reaction during Exposure in Chemically Amplified Resists for Lithography Simulation
- Analysis of Deprotection Reaction in Chemically Amplified Resists Using an Fourier Transform Infrared Spectrometer with an Exposure Tool
- Study on Improved Resolution of Thick Film Resist
- Measurement of Parameters for Simulation of 193 nm Lithography Using Fourier Transform Infrared Baking System
- Approach for High-resolution of Chemically Amplified Resists Using Rate Editor Software