Wetting Kinetics and the Interfacial Interaction Behavior between Electroless Ni-Cu-P and Molten Solder

スポンサーリンク

概要

• 論文の詳細を見る

• Formation of intermetallic compounds and wetting kinetics between an electroless Ni-Cu-P deposit and molten solder were investigated. The microstructure and phase of the interface were investigated with the aid of scanning electron microscopy (SEM) and X-ray diffractometry (XRD). Intermetallic compounds Ni_3Sn_4 and Ni_3Sn_2 were formed between Ni-Cu-P deposit and solder with Cu existing in the intermetallic layer. The contact angles of molten solder on a Ni-Cu-P deposit, measured with the sessile drop method, decrease with increasing temperature and time. The activation energy for wetting of molten solder on a Ni-Co-P deposit was estimated to be 193.7 kJ mol^<-1>.

• 社団法人応用物理学会の論文
• 1994-05-15

著者

• Lin K‐l

  National Cheng Kung Univ. Tainan Twn

• Lin Kwang-lung

  Department Of Materials Science And Engineering National Cheng Kung University

• LEE Chwan-Wing

  Department of Materials Science and Engineering, National Cheng Kung University

• Lee Chwan-wing

  Department Of Materials Science And Engineering National Cheng Kung University

関連論文

• ZrAl_3 Intermetallic Compound Thin Film as a Diffusion Barrier between Al and Au Layers
• Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer
• Solderability of Electroless Nickel Alloys Using Wetting Balance Technique
• Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys
• Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
• Wetting Kinetics and the Interfacial Interaction Behavior between Electroless Ni-Cu-P and Molten Solder

スポンサーリンク