Lin Kwang-lung | Department Of Materials Science And Engineering National Cheng Kung University
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概要
関連著者
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Lin Kwang-lung
Department Of Materials Science And Engineering National Cheng Kung University
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LIN Kwang-Lung
Department of Materials Science and Engineering, National Cheng Kung University
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Ho Jin-kuo
Department Of Materials Science And Engineering National Cheng Kung University
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Song Jenn-ming
Department Of Materials Science And Engineering National Cheng Kung University
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Lee C‐y
Orion Electric Co. Ltd. Kumi Kor
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Lin K‐l
National Cheng Kung Univ. Tainan Twn
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Lin Kwang-lung
Department Of Materials Science And Engineering National Cheng-kung University
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LEE Chwan-Ying
Department of Materials Science and Engineering, National Cheng Kung University
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CHENG Shou-Chang
Department of Electronics Engineering and Computer Science, Tung-Fang Institute of Technology
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LIU Nai-Shuo
Department of Materials Science and Engineering, National Cheng Kung University
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LEE Chwan-Wing
Department of Materials Science and Engineering, National Cheng Kung University
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HUANG Chia-Wei
Department of Materials Science and Engineering, National Cheng Kung University
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Huang Chia-wei
Department Of Materials Science And Engineering National Cheng Kung University
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Liu Nai-shuo
Department Of Materials Science And Engineering National Cheng Kung University
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Lee Chwan-wing
Department Of Materials Science And Engineering National Cheng Kung University
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Cheng Shou-chang
Department Of Electronics Engineering And Computer Science Tung-fang Institute Of Technology
著作論文
- ZrAl_3 Intermetallic Compound Thin Film as a Diffusion Barrier between Al and Au Layers
- Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer
- Solderability of Electroless Nickel Alloys Using Wetting Balance Technique
- Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys
- Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
- Wetting Kinetics and the Interfacial Interaction Behavior between Electroless Ni-Cu-P and Molten Solder